Where Compute Reigns
3rd Gen Intel® Xeon® Scalable Processors – “Ice Lake”
GIGABYTE servers and Intel Xeon Scalable Processors deliver incredible 1P/2P performance from edge to data center with incredible gains in I/O throughput and workload demands that need high performing CPUs with large, yet optimized, memory configurations.

- Enhanced I/0: Support for PCIe 4.0 allows for double the throughput of PCIe 3.0 for fast and large data transfers. Also, 64 lanes per socket with up to 128 lanes in a 2P configuration for fast data transmission from CPU to GPU, accelerator or storage.
- CPU Performance Boost: Now up to 40 cores per socket with greatly improved IPC on Intel’s 10nm architecture while operating CPUs at 105-270W. Also, an additional UPI lane is added for up to 11.2GT/s for a low latency interconnect between CPUs.
- Next Gen Memory: Support for DDR4-3200MHz (1DPC or 2DPC) DIMM. 8 channel memory has been added with up to 16 DIMMs per socket delivering up to 4TB of system memory via usage of 256GB DDR4 DIMM. Additionally, 2/4/6/8-way interleaves for optimal configuration.
- Arrival of Intel Optane PMem 200 Series: Optimized for improvements in latency while increasing system memory up to 6TB per socket as a mix of PMem and DDR. The 200 Series also has support for memory mode to expand capacity and app direct mode to act as fast flash storage.
- Next Level Security: New instructions and architecture deliver a high level of cryptographic operations for data privacy and protection. Cryptographic accelerators speed up encryption protocols as well as improvements in software guard extensions and memory encryption are added.
- AI Acceleration: AI inference and training are enhanced with DL Boost Technology for greater business, operational, and security insights. Applications include HPC, AI, and Media & Graphics.


Accelerator Computing
Support 3 GPU cards and keep 2 FHFL AIC
Parallel processing with multiple GPUs are driving discoveries and powering AI and data analytics. Offering support for dual slot GPUs allows for the highest, dense GPU compute possible. Delivering the fastest throughput for data, PCIe Gen 4 lanes are all in x16 mode for a total bandwidth of 64GB/s per GPU.

Flexibility
Mixed storage for HDD capacity or SSD cache
GIGABYTE servers have incorporated a high level of flexibility. Servers can accommodate large capacity power supplies to support demanding processors. As well, mixed drives allow for varying form factors and storage speed protocols. Various expansion slots to house dual slot GPU cards or other accelerators, with additional options for NICs and OCP solutions.

Availability
Dual ROM ensure server operate independently
Downtime is not a word wanted to be heard in IT. The ability to have stable and continuous server operation is crucial for business operations. Steps have been taken with redundant PSUs, hot-swap drives, dual ROM, and fault tolerances to ensure GIGABYTE servers operate independently from anywhere.

Server Management
GIGABYTE offers free-of-charge server management applications via small processor (BMC) built on the server.

Provides:

- Server health monitoring
- Remote troubleshooting
- Resource utilization monitoring
- Reduction in server downtimes
GIGABYTE Management Console
- Single server management
- Feature-rich and easy to use browser-based interface
- Integration of 3rd party applications
- Automatic recording function
- SAS / RAID controller monitoring function

Certified Ready with Software Partners
Being a member of key software alliance partner programs enables GIGABYTE to together rapidly develop and validate joint solutions, enabling our customers to modernize their data centers and implement IT infrastructure and application services with speed, agility, and cost optimization. GIGABYTE servers have a compatibility across various ecosystems.

Support Various Computing Accelerators
GIGABYTE servers have been tested and validated across a range of workloads with various computing accelerators designed to deliver high levels of performance for deep learning, high performance computing (HPC), enabling data scientists, researchers, and engineers to tackle challenges that were once impossible.

Specification

Product
Product id	792544
Brand	Gigabyte
Partnr	6NR282G30MR-00
EAN/UPC code	4719331600150
Processor
Built-in processor	N
Motherboard chipset	Intel C621
Processor socket	LGA 4189
Processor manufacturer	Intel
Processor family	Intel Xeon Scalable
Memory
Number of DIMM slots	32
Supported memory types	DDR4-SDRAM
Supported DIMM module capacities	2GB, 3GB, 4GB, 8GB, 16GB, 32GB, 64GB, 128GB
Supported RDIMM clock speeds	2666, 2933, 3200 MHz
Memory voltage	1.2 V
Storage
Number of storage drives supported	12
Hot-swap HDD bays	Y
Number of 2.5" bays	8
Number of 3.5" bays	4
Storage drive sizes supported	2.5, 3.5 "
Supported storage drive types	HDD & SSD
Graphics
On-board graphics adapter model	Aspeed AST2600
Network
Ethernet LAN	Y
Ethernet interface type	Gigabit Ethernet
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Ports & interfaces
Ethernet LAN (RJ-45) ports	2
VGA (D-Sub) ports quantity	1
Expansion slots
PCI Express slots version	4.0
PCI Express x16 slots	5
Features
Trusted Platform Module (TPM)	Y
Trusted Platform Module (TPM) version	2.0
Backplanes support	Y
Compatible operating systems	Windows Server 2016 Windows Server 2019 Red Hat Enterprise Linux 8.2 ( x64) or later Red Hat Enterprise Linux 8.3 ( x64) or later SUSE Linux Enterprise Server 12 SP5 ( x64) or later SUSE Linux Enterprise Server 15 SP2 ( x64) or later Ubuntu 20.04 LTS (x64) or later Ubuntu 20.04.1 LTS (x64) or later VMware ESXi 6.7 Update3 P03 VMware ESXi 7.0 Update2 Citrix Hypervisor 8.2.0
Design
Chassis type	Rack (2U)
LED indicators	HDD, LAN, Power, Status
On/off switch	Y
Reset button	Y
Number of fans	4 ventilator(en)
Fan diameter	80 mm
Power
Power supply	2400 W
AC input voltage	180 - 240 V
AC input frequency	47 - 63 Hz
Input current	14.5 A
DC output current (+12 V)	84 A
80 PLUS certification	80 PLUS Platinum
Packaging data
Packaging content	1 x R282-G30 2 x CPU heatsinks 1 x Rail kit
Package width	982 mm
Package depth	588 mm
Package height	268 mm