Gigabyte MD70-HB0. Processor manufacturer: Intel, Processor socket: LGA 2011-v3, Compatible processor series: Intel® Xeon®. Supported memory types: DDR4-SDRAM, Memory channels: Quad-channel, Memory voltage: 1.2 V. Supported storage drive interfaces: Serial Attached SCSI (SAS), RAID levels: 0, 1, 1E, 5, 10. On-board graphics card model: Aspeed AST2400. Ethernet interface type: 10 Gigabit Ethernet, Gigabit Ethernet, LAN controller: Intel® X540

Specification

Product
Product id	811357
Brand	Gigabyte
Partnr	9MD70HB0MR-00
EAN/UPC code	4719331837266
Processor
Processor manufacturer	Intel
Processor socket	LGA 2011-v3
Compatible processor series	Intel Xeon
Intel Xeon series	E5-2600
Memory
Supported memory types	DDR4-SDRAM
Memory channels	Quad-channel
Memory voltage	1.2 V
ECC	Y
Supported memory clock speeds	1600, 1866, 2133, 2400 MHz
Storage controllers
Supported storage drive interfaces	Serial Attached SCSI (SAS)
RAID levels	0, 1, 1E, 5, 10
RAID support	Y
Graphics
On-board graphics adapter model	Aspeed AST2400
Internal I/O
USB 2.0 connectors	1
USB 3.2 Gen 1 (3.1 Gen 1) connectors	1
Number of SATA III connectors	10
ATX Power connector (24-pin)	Y
CPU fan connector	Y
Number of chassis fan connectors	5
Chassis intrusion connector	Y
Serial port headers	1
TPM connector	Y
Integrated SAS ports	2
Rear panel I/O ports
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	2
Ethernet LAN (RJ-45) ports	3
VGA (D-Sub) ports quantity	1
Serial ports quantity	1
Network
Ethernet LAN	Y
Ethernet interface type	10 Gigabit Ethernet, Gigabit Ethernet
LAN controller	Intel X540
Wi-Fi	N
Wi-Fi standards	Not supported
Features
Component for	Server
Motherboard form factor	Extended ATX
Motherboard chipset	Intel C612
PC health monitoring	FAN, Temperature, Voltage
Harmonized System (HS) code	84733020
Expansion slots
PCI Express x16 (Gen 3. x) slots	3
BIOS
Clear CMOS button	Y
Processor special features
Intelligent Platform Management Interface (IPMI) support	Y
Integrated BMC with IPMI	Y
Trusted Platform Module (TPM)	Y
Operational conditions
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	8 - 80 procent
Storage relative humidity (H-H)	20 - 95 procent
Packaging data
Package width	473 mm
Package depth	600 mm
Package height	495 mm
Weight & dimensions
Width	305 mm
Depth	330 mm
Technical details
USB version	3.2 Gen 1 (3.1 Gen 1)
Other features
DVI port	N
PCI Express x8 (Gen 2. x) slots	1
Supported DIMM module capacities	1GB, 2GB, 4GB, 8GB, 16GB, 32GB, 64GB, 128MB
Supported LRDIMM clock speeds	1600, 1866, 2133, 2400 MHz
Supported RDIMM clock speeds	1600, 1866, 2133, 2400 MHz
Supported RDIMM module capacity	1GB, 2GB, 4GB, 8GB, 16GB, 32GB
Disk on Module (DOM) power connector	Y
Number of processors supported	2
Number of DIMM slots	16