Intel MB 2xLGA2011-3 16xDIMM 2x1GbE 10xSATA3 4xPCIe3

 
Gigabyte MD70-HB2. Processor manufacturer: Intel, Processor socket: LGA 2011-v3, Compatible processor series: Intel® Xeon®. Supported memory types: DDR4-SDRAM, Memory channels: Quad-channel, Memory voltage: 1.2 V. Supported storage drive interfaces: SATA III, RAID levels: 0, 1, 5, 10. On-board graphics card model: Aspeed AST2400. Ethernet interface type: Gigabit Ethernet, LAN controller: Intel® I350-AM2

Specification

Product
Product id 811358
Brand Gigabyte
Partnr 9MD70HB2MR-00
EAN/UPC code 4719331832254
Processor
Processor manufacturer Intel
Processor socket LGA 2011-v3
Compatible processor series Intel Xeon
Intel Xeon series E5-2600
Memory
Supported memory types DDR4-SDRAM
Memory channels Quad-channel
Memory voltage 1.2 V
ECC Y
Supported memory clock speeds 1600, 1866, 2133, 2400 MHz
Storage controllers
Supported storage drive interfaces SATA III
RAID levels 0, 1, 5, 10
RAID support Y
Graphics
On-board graphics adapter model Aspeed AST2400
Internal I/O
USB 2.0 connectors 1
USB 3.2 Gen 1 (3.1 Gen 1) connectors 1
Number of SATA III connectors 10
ATX Power connector (24-pin) Y
CPU fan connector Y
Number of chassis fan connectors 5
Chassis intrusion connector Y
Serial port headers 1
TPM connector Y
Rear panel I/O ports
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity 2
Ethernet LAN (RJ-45) ports 3
VGA (D-Sub) ports quantity 1
Serial ports quantity 1
Network
Ethernet LAN Y
Ethernet interface type Gigabit Ethernet
LAN controller Intel I350-AM2
Wi-Fi N
Wi-Fi standards Not supported
Features
Component for Server
Motherboard form factor Extended ATX
Motherboard chipset Intel C612
PC health monitoring FAN, Temperature, Voltage
Harmonized System (HS) code 84733020
Expansion slots
PCI Express x16 (Gen 3. x) slots 3
BIOS
Clear CMOS button Y
Processor special features
Intelligent Platform Management Interface (IPMI) support Y
Integrated BMC with IPMI Y
Trusted Platform Module (TPM) Y
Operational conditions
Storage temperature (T-T) -40 - 60 °C
Operating temperature (T-T) 10 - 35 °C
Operating relative humidity (H-H) 8 - 80 procent
Storage relative humidity (H-H) 20 - 95 procent
Packaging data
Package width 473 mm
Package depth 600 mm
Package height 495 mm
Weight & dimensions
Width 305 mm
Depth 330 mm
Technical details
USB version 3.2 Gen 1 (3.1 Gen 1)
Other features
DVI port N
PCI Express x8 (Gen 2. x) slots 1
Supported DIMM module capacities 1GB, 2GB, 4GB, 8GB, 16GB, 32GB, 64GB, 128MB
Supported LRDIMM clock speeds 1600, 1866, 2133, 2400 MHz
Supported RDIMM clock speeds 1600, 1866, 2133, 2400 MHz
Supported RDIMM module capacity 1GB, 2GB, 4GB, 8GB, 16GB, 32GB
Disk on Module (DOM) power connector Y
Number of processors supported 2
Number of DIMM slots 16