ThinkSystem ST550 Xeon Silver4110

 

Lenovo
Not in stock
€ 990,68
€ 1.198,72 incl 21% VAT
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software.

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Specification

Product
Product id 578569
Brand Lenovo
Partnr 4XG7A07215
EAN/UPC code 889488435142
Processor
Processor family Intel Xeon
Processor base frequency 2.1 GHz
Processor cores 8
Processor socket LGA 3647 (Socket P)
Component for Server/Workstation
Processor lithography 14 nm
Processor model 4110
Processor threads 16
Processor operating modes 64-bit
Processor cache 11 MB
Processor cache type L3
Thermal Design Power (TDP) 85 W
Processor boost frequency 3 GHz
Processor codename Skylake
Memory
Maximum internal memory supported by processor 768 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2400 MHz
Memory channels Hexa-channel
ECC Y
Graphics
On-board graphics adapter N
Features
Maximum number of PCI Express lanes 48
PCI Express slots version 3.0
Supported instruction sets AVX, AVX 2.0, AVX-512, SSE4.2
Embedded options available Y
Processor special features
Intel® AES New Instructions (Intel® AES-NI) Y
Intel Trusted Execution Technology Y
Intel® Speed Shift Technology Y
Intel® Hyper Threading Technology (Intel® HT Technology) Y
Intel® Turbo Boost Technology 2.0
Intel® Optane™ Memory Ready N
Intel® vPro™ Platform Eligibility Y
Intel Turbo Boost Max Technology 3.0 N
Conflict-Free processor Y
Intel TSX-NI Y
Intel Virtualization Technology (VT-x) Y
Intel 64 Y
Operational conditions
Tcase 77 °C
Weight & dimensions
Processor package size 76 x 56.5 mm