SR630 V2 Gold 5317 12C 150W 3.0GHz

 

Lenovo
Not in stock
€ 1.869,74
€ 2.262,38 incl 21% VAT
Lenovo Xeon Intel Gold 5317. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4189, Processor lithography: 10 nm. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: SSE4.2, AVX, AVX 2.0, AVX-512, Scalability: 2S. Maximum Enclave Size Support for Intel® SGX: 64 GB. Processor package size: 77.5 x 56.5 mm

Specification

Product
Product id 948347
Brand Lenovo
Partnr 4XG7A63412
EAN/UPC code 889488530892
Processor
Processor manufacturer Intel
Processor family Intel Xeon Gold
Processor base frequency 3 GHz
Processor generation Intel Xeon Scalable 3rd Gen
Processor cores 12
Processor socket LGA 4189
Component for Server/Workstation
Processor lithography 10 nm
Processor series Intel Xeon Gold 5000 Series
Processor model 5317
Processor threads 24
System bus rate 11.2 GT/s
Processor operating modes 64-bit
Processor cache 18 MB
Thermal Design Power (TDP) 150 W
Processor boost frequency 3.6 GHz
Processor codename Ice Lake
Memory
Maximum internal memory supported by processor 6000 GB
Memory types supported by processor DDR4-SDRAM
Memory channels Octa-channel
ECC Y
Graphics
On-board graphics adapter N
Discrete graphics adapter N
On-board graphics adapter model Not available
Discrete graphics adapter model Not available
Features
Execute Disable Bit Y
Maximum number of PCI Express lanes 64
PCI Express slots version 4.0
Supported instruction sets SSE4.2, AVX, AVX 2.0, AVX-512
Scalability 2S
Embedded options available Y
Market segment Server
Harmonized System (HS) code 8542310001
Export Control Classification Number (ECCN) 5A992CN3
Commodity Classification Automated Tracking System (CCATS) G178966
Processor special features
Intel® AES New Instructions (Intel® AES-NI) Y
Intel Trusted Execution Technology Y
Intel® Speed Shift Technology Y
Intel® Hyper Threading Technology (Intel® HT Technology) Y
Intel® Turbo Boost Technology 2.0
Intel® Transactional Synchronization Extensions Y
Intel® Total Memory Encryption Y
Intel® Optane™ DC Persistent Memory Supported Y
AVX-512 Fused Multiply-Add (FMA) units 2
Intel® Crypto Acceleration Y
Intel® Platform Firmware Resilience Support Y
Maximum Enclave Size Support for Intel® SGX 64 GB
Intel® Deep Learning Boost (Intel® DL Boost) Y
Intel® Resource Director Technology (Intel® RDT) Y
Intel® Volume Management Device (VMD) Y
Intel® Run Sure Technology Y
Mode-based Execute Control (MBE) Y
Intel VT-x with Extended Page Tables (EPT) Y
Intel Virtualization Technology (VT-x) Y
Intel Virtualization Technology for Directed I/O (VT-d) Y
Intel 64 Y
Intel Software Guard Extensions (Intel SGX) Y
Operational conditions
Tcase 84 °C
Technical details
Supported memory types DDR4-SDRAM
Target market Cloud Computing
Number of UPI links 3
Memory speed (max) 2933 MHz
Launch date Q2'21
Status Launched
Weight & dimensions
Processor package size 77.5 x 56.5 mm
Other features
Maximum internal memory 6000 GB