Product |
Product id |
889000 |
Brand |
Intel |
Partnr |
CD8068904572601 |
EAN/UPC code |
8592978314408 |
Warranty (months) |
12 months |
Processor |
Processor manufacturer |
Intel |
Processor family |
Intel Xeon Platinum |
Processor model |
8380 |
Processor codename |
Ice Lake |
Processor generation |
Intel Xeon Scalable 3rd Gen |
Box |
N |
Cooler included |
N |
Component for |
Server/Workstation |
Processor socket |
FCLGA4189 |
Processor cores |
40 |
Processor threads |
80 |
High priority cores |
16 |
Low priority cores |
24 |
Processor base frequency |
2.3 GHz |
Processor boost frequency |
3.4 GHz |
Low priority core frequency |
2.2 GHz |
Thermal Design Power (TDP) |
270 W |
Processor lithography |
10 nm |
System bus rate |
11.2 GT/s |
Processor operating modes |
64-bit |
Processor cache |
60 MB |
High priority core frequency |
2.4 GHz |
Processor ARK ID |
212287 |
Memory |
Maximum internal memory supported by processor |
6144 GB |
Memory types supported by processor |
DDR4-SDRAM |
Memory clock speeds supported by processor |
3200 MHz |
Memory channels |
Octa-channel |
ECC |
Y |
Graphics |
On-board graphics adapter |
N |
Discrete graphics adapter |
N |
On-board graphics adapter model |
Not available |
Discrete graphics adapter model |
Not available |
Features |
Execute Disable Bit |
Y |
Maximum number of PCI Express lanes |
64 |
PCI Express slots version |
4.0 |
Supported instruction sets |
SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability |
2S |
Embedded options available |
N |
Market segment |
Server |
Harmonized System (HS) code |
85423119 |
Export Control Classification Number (ECCN) |
5A992CN3 |
Commodity Classification Automated Tracking System (CCATS) |
G178966 |
Processor special features |
Intel® AES New Instructions (Intel® AES-NI) |
Y |
Intel Trusted Execution Technology |
Y |
Intel® Speed Shift Technology |
Y |
Intel® Hyper Threading Technology (Intel® HT Technology) |
Y |
Intel® Turbo Boost Technology |
2.0 |
Intel® Transactional Synchronization Extensions |
Y |
Intel® Total Memory Encryption |
Y |
Intel® Optane™ DC Persistent Memory Supported |
Y |
Intel® Optane™ Memory Ready |
Y |
AVX-512 Fused Multiply-Add (FMA) units |
2 |
Intel® Crypto Acceleration |
Y |
Intel® Platform Firmware Resilience Support |
Y |
Maximum Enclave Size Support for Intel® SGX |
512 GB |
Intel® Deep Learning Boost (Intel® DL Boost) |
Y |
Intel® Resource Director Technology (Intel® RDT) |
Y |
Intel® Volume Management Device (VMD) |
Y |
Intel® Run Sure Technology |
Y |
Mode-based Execute Control (MBE) |
Y |
Intel VT-x with Extended Page Tables (EPT) |
Y |
Intel Virtualization Technology (VT-x) |
Y |
Intel Virtualization Technology for Directed I/O (VT-d) |
Y |
Intel 64 |
Y |
Intel Software Guard Extensions (Intel SGX) |
Y |
Operational conditions |
Tcase |
83 °C |
Technical details |
Supported memory types |
DDR4-SDRAM |
Target market |
High Performance Computing |
Number of UPI links |
3 |
Memory speed (max) |
3200 MHz |
Launch date |
Q2'21 |
Status |
Launched |
Servicing status |
Baseline Servicing |
Weight & dimensions |
Processor package size |
77.5 x 56.5 mm |
Other features |
Maximum internal memory |
6000 GB |